首页> 外文OA文献 >Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

【2h】

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

机译：适用于配备QFN64装置的智能建筑的电子组件的热状态经过自然对流

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Baïri, Abderrahmane; Roseiro, L; Martin Garin, A; Adeyeye, Kemi; Millan, J.A.;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection [J] . Bairi A., Roseiro L., Martin-Garin A., Microelectronics & Reliability . 2017,第MARa期

机译：适用于配备QFN64装置的智能建筑的电子组件的热状态经过自然对流
2. Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection [J] . Baïri Abderrahmane, Hermoso Clara Ortega, Martin David San, International journal of numerical methods for heat & fluid flow . 2017,第6期

机译：带有倾斜和低功率QFN64的电子组件的表面温度经过自由对流
3. Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin [J] . Bairi A., Nithyadevi N., Bairi I., Energy and Buildings . 2017,第APRa期

机译：装有QFN电子设备且经过自由对流的楼宇控制传感器的热设计。封装树脂的作用
4. DEVELOPMENT OF THERMAL FLOW SIMULATION METHOD FOR ELECTRONIC EQUIPMENT INTEGRATED WITH ELECTRIC CIRCUIT DESIGN: (APPLICATION TO THE THERMAL DESIGN OF A NATURAL CONVECTION AIR COOLING SMPS) [C] . Katsuhiro Koizumi, Masaru Ishizuka American Society of Mechanical Engineers(ASME) Heat Transfer/Fluids Engineering Summer Conference 2004(HT/FED 2004) vol.4; 20040711-15; Charlotte,NC(US) . 2004

机译：集成电路设计的电子设备热流模拟方法的发展：（应用于自然对流空气冷却SMPS的热设计）
5. Thermal Management for Low-Power Handheld Electronic Devices using Thermoacoustics and Forced Convection by Vibrating Cantilever Beam [D] . Kim, Jang Woo 2012

机译：使用热声和通过振动悬臂梁进行对流的低功耗手持式电子设备的热管理
6. Electricity Usage Scheduling in Smart Building Environments Using Smart Devices [O] . Eunji Lee, Hyokyung Bahn 2013

机译：使用智能设备的智能建筑环境中的用电计划
7. Thermal Design Method of an Electronic Enclosure with Natural Ventilation. Study on Natural Convection Phenomenon in Electronic Enclosure with an Array of Vertical Parallel Plates. [O] . Takashi KOBAYASHI, Tetsurou OGUSHI, Masao FUJII 2002

机译：具有自然通风的电子外壳的热设计方法。垂直平行板阵列电子外壳中自然对流现象研究。
8. Thermal Modeling of Phase Change Solidification in Thermal Control Devices Including Natural Convection Effects [R] . Ukanwa, A. O., Stermole, F. J., Golden, J. O. 1972

机译：包含自然对流效应的热控装置相变凝固热模型

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

著录项

引文网络

相似文献

相关主题

期刊订阅